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Printed Circuit Boards


PES Thermoset Many thermosets need to be plasticized or made flame-retardant. Phenol formaldehyde (PF) resins, which are used in the manufacture of printed circuit boards, can be made flame-retardant by the addition of Disflamoll® DPK or TP. Our additives are also capable of elasticizing brittle resin so that it can withstand additional production processes such as punching without breaking. Polyester (PES) and epoxy (EP) resins can also be elasticized using Disflamoll® DPK or DPO. Disflamoll® products are highly compatible and improve the low-temperature flexibility required for materials and coatings. Our products are also suitable as carriers for resin additives. They can be used as formulating auxiliaries, e.g. to obtain a certain viscosity, or to improve the processing characteristics of resin compounds.

 

Printed Circuit Boards

  
Overview of product grades
Grade Name Description
Links 
DisflamollŽ DPK Flame retardant with plasticizing properties for PVC, phenolic resin and NBR - Diphenyl cresyl phosphate  
Data sheet  DE
EN
DisflamollŽ DPO Flame retardant with plasticizing properties for PVC and NBR, low smoke density and lightfast - Diphenyl-2-ethylhexyl phosphate  
Data sheet  DE
EN
DisflamollŽ TKP Flame retardant with plasticizing properties for PVC, phenolic resin and films - Tricresyl phosphate  
Data sheet  DE
EN